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TRACEABILITY There are 369 products.

  • Date Stamp Plus Ø6 BLANK

    FP063200

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø6 Year 2019

    FP063205-19

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø6 Year 2020

    FP063205-20

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø6 Month 2019

    FP063212-19

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø6 Month 2020

    FP063212-20

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø6 SF

    FP0632SF

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø8 BLANK

    FP084700

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø8 Year 2019

    FP084705-19

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø8 Year 2020

    FP084705-20

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø8 Month 2019

    FP084712-19

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø8 Month 2020

    FP084712-20

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø8 SF

    FP0847SF

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø10 BLANK

    FP105700

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø10 Year 2019

    FP105706-19

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø10 Year 2020

    FP105706-20

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø10 Month 2019

    FP105712-19

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø10 Month 2020

    FP105712-20

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø10 SF

    FP1057SF

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø12 BLANK

    FP126700

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø12 Year 2019

    FP126708-19

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø12 Year 2020

    FP126708-20

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø12 Month 2019

    FP126712-19

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø12 Month 2020

    FP126712-20

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø12 SF

    FP1267SF

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø16 BLANK

    FP168700

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø16 Year 2019

    FP168710-19

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø16 Year 2020

    FP168710-20

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø16 Month 2019

    FP168712-19

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø16 Month 2020

    FP168712-20

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø16 SF

    FP1687SF

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø20 BLANK

    FP200700

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø20 Year 2019

    FP200710-19

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø20 Year 2020

    FP200710-20

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø20 Month 2019

    FP200712-19

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø20 Month 2020

    FP200712-20

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • Date Stamp Plus Ø20 SF

    FP2007SF

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp. Exact outer number positioning. Ideal clamping area.

    Possibility for cooling circuits below the date stamp as they are removed from the...

    Possibility for cooling circuits below the date stamp as they are removed from the front (with the EF). Inner insert is always at the same level as the body of the date stamp....

  • High Tem. Date Ø8 BLANK

    FT084700

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

    Designed for injection mold tools which operate in high temperature environments, like:...

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

  • High Tem. Date Ø8 Year 2019

    FT084705-19

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

    Designed for injection mold tools which operate in high temperature environments, like:...

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

  • High Tem. Date Ø8 Year 2020

    FT084705-20

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

    Designed for injection mold tools which operate in high temperature environments, like:...

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

  • High Tem. Date Ø8 Months 2019

    FT084712-19

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

    Designed for injection mold tools which operate in high temperature environments, like:...

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

  • High Tem. Date Ø8 Months 2020

    FT084712-20

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

    Designed for injection mold tools which operate in high temperature environments, like:...

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

  • High Tem. Date Ø8 SF

    FT0847SF

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

    Designed for injection mold tools which operate in high temperature environments, like:...

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

  • High Tem. Date Ø12 BLANK

    FT126700

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

    Designed for injection mold tools which operate in high temperature environments, like:...

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

  • High Tem. Date Ø12 Year 2019

    FT126708-19

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

    Designed for injection mold tools which operate in high temperature environments, like:...

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

  • High Tem. Date Ø12 Year 2020

    FT126708-20

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

    Designed for injection mold tools which operate in high temperature environments, like:...

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

  • High Tem. Date Ø12 Months 2019

    FT126712-19

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

    Designed for injection mold tools which operate in high temperature environments, like:...

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

  • High Tem. Date Ø12 Months 2020

    FT126712-20

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

    Designed for injection mold tools which operate in high temperature environments, like:...

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

  • High Tem. Date Ø12 Months 2021

    FT126712-21

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..

    Designed for injection mold tools which operate in high temperature environments, like:...

    Designed for injection mold tools which operate in high temperature environments, like: Zamak, Zinc, Polyester, Bakelite, etc..